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Material• Taconic
• MAGTRON
• FR 4
• ISOLA
• Polymide-Flex
• Metal Core
Min. Dieletric Thickness2 mil
Max. Layer Count50
Max. Working Panel Size21" x 31"
Max. Board Thickness.300"
Min. Board Thickness0.16"(6L)
Min. Line/Space• I/L - 2 / 1.5mil (HDI)
• O/L - 2 / 1.5 mil (HDI)
Warpage.001" / sq. in.
BGA Pitch0.20mm
Layer to Layer Registration3 mil (HDI)
Finish Hole Size• Mechanical Drill - 4 mil (HDI)
• Laser Drill - 2.5 mil (HDI)
True Hole Position +/-.0015"
Finish Hole Size Tolerance • PTH - +/-.0015"
• Non-PTH - +/-.001"
Aspect Ratio (Board Tks./FHS)30
Heavy Copper• Inner Layer - 10 oz
• Inner Layer - 16 oz
Buried/Blind Via10+N+10 (HDI)
Plasma DesmearYes
Outline Tolerance+/-.004
Surface Finish• HASL
• ENIG
• Immersion Silver
• OSP (ENTEK)
• Carbon
• Immersion Tin
• Electrolyic Gold
• ENEPIG
• ENIPIG
Impeadance Control+/-5%
RoHS CompliantYes

Material• Taconic
• MAGTRON
• FR 4
• ISOLA
• Polymide-Flex
• Metal Core
Min. Dieletric Thickness2 mil
Max. Layer Count50
Max. Working Panel Size21" x 31"
Max. Board Thickness.300"
Min. Board Thickness0.16"(6L)
Min. Line/Space• I/L - 2 / 1.5mil (HDI)
• O/L - 2 / 1.5 mil (HDI)
Warpage.001" / sq. in.
BGA Pitch0.20mm
Layer to Layer Registration3 mil (HDI)
Finish Hole Size• Mechanical Drill - 4 mil (HDI)
• Laser Drill - 2.5 mil (HDI)
True Hole Position +/-.0015"
Finish Hole Size Tolerance • PTH - +/-.0015"
• Non-PTH - +/-.001"
Aspect Ratio (Board Tks./FHS)30
Heavy Copper• Inner Layer - 10 oz
• Inner Layer - 16 oz
Buried/Blind Via10+N+10 (HDI)
Plasma DesmearYes
Outline Tolerance+/-.004
Surface Finish• HASL
• ENIG
• Immersion Silver
• OSP (ENTEK)
• Carbon
• Immersion Tin
• Electrolyic Gold
• ENEPIG
• ENIPIG
Impeadance Control+/-5%
RoHS CompliantYes

Material• Taconic
• MAGTRON
• FR 4
• ISOLA
• Polymide-Flex
• Metal Core
Min. Dieletric Thickness2 mil
Max. Layer Count50
Max. Working Panel Size21" x 31"
Max. Board Thickness.300"
Min. Board Thickness0.16"(6L)
Min. Line/Space• I/L - 2 / 1.5mil (HDI)
• O/L - 2 / 1.5 mil (HDI)
Warpage.001" / sq. in.
BGA Pitch0.20mm
Layer to Layer Registration3 mil (HDI)
Finish Hole Size• Mechanical Drill - 4 mil (HDI)
• Laser Drill - 2.5 mil (HDI)
True Hole Position +/-.0015"
Finish Hole Size Tolerance • PTH - +/-.0015"
• Non-PTH - +/-.001"
Aspect Ratio (Board Tks./FHS)30
Heavy Copper• Inner Layer - 10 oz
• Inner Layer - 16 oz
Buried/Blind Via10+N+10 (HDI)
Plasma DesmearYes
Outline Tolerance+/-.004
Surface Finish• HASL
• ENIG
• Immersion Silver
• OSP (ENTEK)
• Carbon
• Immersion Tin
• Electrolyic Gold
• ENEPIG
• ENIPIG
Impeadance Control+/-5%
RoHS CompliantYes

Material• Taconic
• MAGTRON
• FR 4
• ISOLA
• Polymide-Flex
• Metal Core
Min. Dieletric Thickness2 mil
Max. Layer Count50
Max. Working Panel Size21" x 31"
Max. Board Thickness.300"
Min. Board Thickness0.16"(6L)
Min. Line/Space• I/L - 2 / 1.5mil (HDI)
• O/L - 2 / 1.5 mil (HDI)
Warpage.001" / sq. in.
BGA Pitch0.20mm
Layer to Layer Registration3 mil (HDI)
Finish Hole Size• Mechanical Drill - 4 mil (HDI)
• Laser Drill - 2.5 mil (HDI)
True Hole Position +/-.0015"
Finish Hole Size Tolerance • PTH - +/-.0015"
• Non-PTH - +/-.001"
Aspect Ratio (Board Tks./FHS)30
Heavy Copper• Inner Layer - 10 oz
• Inner Layer - 16 oz
Buried/Blind Via10+N+10 (HDI)
Plasma DesmearYes
Outline Tolerance+/-.004
Surface Finish• HASL
• ENIG
• Immersion Silver
• OSP (ENTEK)
• Carbon
• Immersion Tin
• Electrolyic Gold
• ENEPIG
• ENIPIG
Impeadance Control+/-5%
RoHS CompliantYes