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Technology Roadmap

Material
  • Taconic
  • MAGTRON
  • FR 4
  • ISOLA
  • Polymide-Flex
  • Metal Core
Min. Dieletric Thickness
2 mil
Max. Layer Count
50
Max. Working Panel Size
21" x 31"
Max. Board Thickness
.300"
Min. Board Thickness
0.16"(6L)
Min. Line/Space
  • I/L - 2 / 1.5mil (HDI)
  • O/L - 2 / 1.5 mil (HDI)
Warpage
.001" / sq. in.
BGA Pitch
0.20mm
Layer to Layer Registration
3 mil (HDI)
Finish Hole Size
  • Mechanical Drill - 4 mil (HDI)
  • Laser Drill - 2.5 mil (HDI)
True Hole Position
+/-.0015"
Finish Hole Size Tolerance
  • PTH - +/-.0015"
  • Non-PTH - +/-.001"
Aspect Ratio (Board Tks./FHS)
30
Heavy Copper
  • Inner Layer - 10 oz
  • Inner Layer - 16 oz
Buried/Blind Via
10+N+10 (HDI)
Plasma Desmear
Yes
Outline Tolerance
+/-.004
Surface Finish
  • HASL
  • ENIG
  • Immersion Silver
  • OSP (ENTEK)
  • Carbon
  • Immersion Tin
  • Electrolyic Gold
  • ENEPIG
  • ENIPIG
Aspect Ratio (Board Tks./FHS)
+/-5%
Heavy Copper
Yes
Material
  • Taconic
  • MAGTRON
  • FR 4
  • ISOLA
  • Polymide-Flex
  • Metal Core
Min. Dieletric Thickness
2 mil
Max. Layer Count
50
Max. Working Panel Size
21" x 31"
Max. Board Thickness
.300"
Min. Board Thickness
0.16"(6L)
Min. Line/Space
  • I/L - 2 / 1.5mil (HDI)
  • O/L - 2 / 1.5 mil (HDI)
Warpage
.001" / sq. in.
BGA Pitch
0.20mm
Layer to Layer Registration
3 mil (HDI)
Finish Hole Size
  • Mechanical Drill - 4 mil (HDI)
  • Laser Drill - 2.5 mil (HDI)
True Hole Position
+/-.0015"
Finish Hole Size Tolerance
  • PTH - +/-.0015"
  • Non-PTH - +/-.001"
Aspect Ratio (Board Tks./FHS)
30
Heavy Copper
  • Inner Layer - 10 oz
  • Inner Layer - 16 oz
Buried/Blind Via
10+N+10 (HDI)
Plasma Desmear
Yes
Outline Tolerance
+/-.004
Surface Finish
  • HASL
  • ENIG
  • Immersion Silver
  • OSP (ENTEK)
  • Carbon
  • Immersion Tin
  • Electrolyic Gold
  • ENEPIG
  • ENIPIG
Aspect Ratio (Board Tks./FHS)
+/-5%
Heavy Copper
Yes
Material
  • Taconic
  • MAGTRON
  • FR 4
  • ISOLA
  • Polymide-Flex
  • Metal Core
Min. Dieletric Thickness
2 mil
Max. Layer Count
50
Max. Working Panel Size
21" x 31"
Max. Board Thickness
.300"
Min. Board Thickness
0.16"(6L)
Min. Line/Space
  • I/L - 2 / 1.5mil (HDI)
  • O/L - 2 / 1.5 mil (HDI)
Warpage
.001" / sq. in.
BGA Pitch
0.20mm
Layer to Layer Registration
3 mil (HDI)
Finish Hole Size
  • Mechanical Drill - 4 mil (HDI)
  • Laser Drill - 2.5 mil (HDI)
True Hole Position
+/-.0015"
Finish Hole Size Tolerance
  • PTH - +/-.0015"
  • Non-PTH - +/-.001"
Aspect Ratio (Board Tks./FHS)
30
Heavy Copper
  • Inner Layer - 10 oz
  • Inner Layer - 16 oz
Buried/Blind Via
10+N+10 (HDI)
Plasma Desmear
Yes
Outline Tolerance
+/-.004
Surface Finish
  • HASL
  • ENIG
  • Immersion Silver
  • OSP (ENTEK)
  • Carbon
  • Immersion Tin
  • Electrolyic Gold
  • ENEPIG
  • ENIPIG
Aspect Ratio (Board Tks./FHS)
+/-5%
Heavy Copper
Yes
Material
  • Taconic
  • MAGTRON
  • FR 4
  • ISOLA
  • Polymide-Flex
  • Metal Core
Min. Dieletric Thickness
2 mil
Max. Layer Count
50
Max. Working Panel Size
21" x 31"
Max. Board Thickness
.300"
Min. Board Thickness
0.16"(6L)
Min. Line/Space
  • I/L - 2 / 1.5mil (HDI)
  • O/L - 2 / 1.5 mil (HDI)
Warpage
.001" / sq. in.
BGA Pitch
0.20mm
Layer to Layer Registration
3 mil (HDI)
Finish Hole Size
  • Mechanical Drill - 4 mil (HDI)
  • Laser Drill - 2.5 mil (HDI)
True Hole Position
+/-.0015"
Finish Hole Size Tolerance
  • PTH - +/-.0015"
  • Non-PTH - +/-.001"
Aspect Ratio (Board Tks./FHS)
30
Heavy Copper
  • Inner Layer - 10 oz
  • Inner Layer - 16 oz
Buried/Blind Via
10+N+10 (HDI)
Plasma Desmear
Yes
Outline Tolerance
+/-.004
Surface Finish
  • HASL
  • ENIG
  • Immersion Silver
  • OSP (ENTEK)
  • Carbon
  • Immersion Tin
  • Electrolyic Gold
  • ENEPIG
  • ENIPIG
Aspect Ratio (Board Tks./FHS)
+/-5%
Heavy Copper
Yes