| Material | • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core |
| Min. Dieletric Thickness | 2 mil |
| Max. Layer Count | 50 |
| Max. Working Panel Size | 21" x 31" |
| Max. Board Thickness | .300" |
| Min. Board Thickness | 0.16"(6L) |
| Min. Line/Space | • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) |
| Warpage | .001" / sq. in. |
| BGA Pitch | 0.20mm |
| Layer to Layer Registration | 3 mil (HDI) |
| Finish Hole Size | • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) |
| True Hole Position | +/-.0015" |
| Finish Hole Size Tolerance | • PTH - +/-.0015" • Non-PTH - +/-.001" |
| Aspect Ratio (Board Tks./FHS) | 30 |
| Heavy Copper | • Inner Layer - 10 oz • Inner Layer - 16 oz |
| Buried/Blind Via | 10+N+10 (HDI) |
| Plasma Desmear | Yes |
| Outline Tolerance | +/-.004 |
| Surface Finish | • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG |
| Impeadance Control | +/-5% |
| RoHS Compliant | Yes |
| Material | • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core |
| Min. Dieletric Thickness | 2 mil |
| Max. Layer Count | 50 |
| Max. Working Panel Size | 21" x 31" |
| Max. Board Thickness | .300" |
| Min. Board Thickness | 0.16"(6L) |
| Min. Line/Space | • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) |
| Warpage | .001" / sq. in. |
| BGA Pitch | 0.20mm |
| Layer to Layer Registration | 3 mil (HDI) |
| Finish Hole Size | • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) |
| True Hole Position | +/-.0015" |
| Finish Hole Size Tolerance | • PTH - +/-.0015" • Non-PTH - +/-.001" |
| Aspect Ratio (Board Tks./FHS) | 30 |
| Heavy Copper | • Inner Layer - 10 oz • Inner Layer - 16 oz |
| Buried/Blind Via | 10+N+10 (HDI) |
| Plasma Desmear | Yes |
| Outline Tolerance | +/-.004 |
| Surface Finish | • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG |
| Impeadance Control | +/-5% |
| RoHS Compliant | Yes |
| Material | • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core |
| Min. Dieletric Thickness | 2 mil |
| Max. Layer Count | 50 |
| Max. Working Panel Size | 21" x 31" |
| Max. Board Thickness | .300" |
| Min. Board Thickness | 0.16"(6L) |
| Min. Line/Space | • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) |
| Warpage | .001" / sq. in. |
| BGA Pitch | 0.20mm |
| Layer to Layer Registration | 3 mil (HDI) |
| Finish Hole Size | • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) |
| True Hole Position | +/-.0015" |
| Finish Hole Size Tolerance | • PTH - +/-.0015" • Non-PTH - +/-.001" |
| Aspect Ratio (Board Tks./FHS) | 30 |
| Heavy Copper | • Inner Layer - 10 oz • Inner Layer - 16 oz |
| Buried/Blind Via | 10+N+10 (HDI) |
| Plasma Desmear | Yes |
| Outline Tolerance | +/-.004 |
| Surface Finish | • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG |
| Impeadance Control | +/-5% |
| RoHS Compliant | Yes |
| Material | • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core |
| Min. Dieletric Thickness | 2 mil |
| Max. Layer Count | 50 |
| Max. Working Panel Size | 21" x 31" |
| Max. Board Thickness | .300" |
| Min. Board Thickness | 0.16"(6L) |
| Min. Line/Space | • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) |
| Warpage | .001" / sq. in. |
| BGA Pitch | 0.20mm |
| Layer to Layer Registration | 3 mil (HDI) |
| Finish Hole Size | • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) |
| True Hole Position | +/-.0015" |
| Finish Hole Size Tolerance | • PTH - +/-.0015" • Non-PTH - +/-.001" |
| Aspect Ratio (Board Tks./FHS) | 30 |
| Heavy Copper | • Inner Layer - 10 oz • Inner Layer - 16 oz |
| Buried/Blind Via | 10+N+10 (HDI) |
| Plasma Desmear | Yes |
| Outline Tolerance | +/-.004 |
| Surface Finish | • HASL • ENIG • Immersion Silver • OSP (ENTEK) • Carbon • Immersion Tin • Electrolyic Gold • ENEPIG • ENIPIG |
| Impeadance Control | +/-5% |
| RoHS Compliant | Yes |