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HDI

HDI – High Density Interconnects

What are HDI's?

HDI (high density interconnection) circuit boards and Micro via Technology are very closely linked.  Micro vias are holes drilled using a laser drilling process. The purpose for these holes is to create electrical connection in between the layers on a multilayer circuit board design.

Via in Pad micro vias play a key role in the process of shrinking down the PCB size. These holes are not to be used for inserting a component lead or any other reinforcing material. However, the ability to either place on or off the pads gives the designers greater flexibility to selectively create routing room in denser parts of the substrate.

What Gives us the Upper Hand?

  • Micro via formation technology using lasers has become the dominant method for drilling micro vias that are also called blind via-holes (BVHs) in printed circuit boards (PCBs). 
  • We use a plate shut process which gives our clients more reliability for micro via process’s than filled with non-conductive ink and then plating over.

Micro via formation technology

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Why use HDI's

  • This technology allows future components, that are becoming smaller, to be used on a wider scale.
  • Electrical performance: The smaller parts used on HDI boards, have shorter internal wire lengths, reduced rise times, and lower power requirements when compared to their larger, alternative packages.
  • Creating a gateway to Miniaturization of PCB design with ‘Via in Pad’ technology.
  • Improved reliability by stepping up technology rather than compromising existing design rules.
  • Giving a wider array of design choices when it comes to BGA layout with the smallest pitch.
  • Opportunities for better thermal enhancement.
  • Increasing interconnection density by reducing plated thru holes, pad size and conductor size reduction.
  • Provides to have via hole connected directly on the surface mount pad or BGA pad.

Laser Drill design minimum requirements

Laser Drill design minimum requirements